General:
Base Material:	FR4, Tg130℃/ Tg170℃, CEM1, Rogers, Metal base board(Aluminum 、 copper, iron)
Min/Max Number of Layers:	1 to 30 layers
Max Dimension of Board:	23inch*35inch
Min/Max Final Thickness Board:	0.21-7.0mm
Copper Foil Thickness:	0.5 OZ to 6 OZ
Finished Surface:	HASL,Flash Gold,Immersion Gold,Immersion Silver,Immersion Tin,OSP,etc
Impedance control	+/- 10%
Solder Mask (colors):	Green,Red,Yellow,White,Black,Blue,etc
Min Soldermask Width:	4mil
Min Soldermask opening:	1.5mil
Silkscreen (min line width):	4mil
Silkscreen (colors):	White,Black,Yellow,etc
Mini Line Width/Space:	3mil
Minimum SMT Pitch:	±15%-20%
Min Drilling Hole:	0.10mm
Min Finished Hole Size/for Thickness Board:	01:12.5
Minimum Annular Ring	12mil
Via hole type: (Buried, blind...)	Buried, blind.
Contour type: (CNC rout, Punch, V-score)	CNC rout, Punch, V-score
V-skore depth / for Min Thickness Board:	1/3 for the board
Min. distance of trace to V-skore:	0.075mm
Min Slot Width:	0.075mm